Senior Mechanical Engineer, Compute and Communications

Highlights

• Own ruggedized compute and communications hardware from concept to field use.
• Design rugged enclosures to keep advanced electronics alive on the battlefield.
• Travel to exercises to support products alongside warfighters and gather feedback.

Ideal candidate

A hands-on mechanical engineer with 6-9 years packaging electronics for harsh environments who thrives owning hardware end-to-end. You have a pioneering spirit, love building prototypes, and want your designs to support warfighters in the field.

Requirements

• 6-9 years of professional mechanical engineering experience
• Demonstrated ability to design, prototype, and ship ruggedized electronics hardware
• Past record of design ownership in a team setting, ideally on enclosures or electromechanical packaging
• Hands-on experience packaging electronics for harsh environments managing thermal, shock, vibration, sealing and EMI constraints
• High competence with, and fluid use of, engineering first principles
• Familiarity with tolerance stack-up analysis and design for high-volume manufacturing
• CAD skills and ability to produce high-quality, GD&T-driven engineering drawings
• Experience with high volume manufacturing methods: machining, sheet metal, injection molding, die casting, composites, etc.
• Demonstrated hands-on fabrication skills
• BS, M.Eng, MS, or PhD in an engineering field
• Must be a U.S. Person due to required access to U.S. export controlled information or facilities
• Experience in NX/Teamcenter
• Experience designing to and testing against MIL-STD-810 and MIL-STD-461
• Knowledge of static, dynamic, thermal, or structural analysis methods in ANSYS
• Active Secret security clearance or the ability to obtain and maintain one