Senior Mission Systems Engineer, Electronic Assemblies, Active Clearance

Highlights

• Join Air Dominance and Strike team building next-gen autonomous military systems.
• Integrate electronics assemblies at module and platform level for real missions.
• Build AI-powered autonomy that turns thousands of data streams into 3D control.

What they offer

• Highly competitive equity grants
• Top-tier benefits for full-time employees

Ideal candidate

A mission-driven hardware owner with deep packaging experience who thrives taking complex electronics from concept through production and validating designs against real hardware.

Requirements

• 10+ years of RF, microwave, or mmWave packaging and integration experience, or 8+ with an advanced degree, including multiple programs carried from concept through qualification and production
• BS in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or equivalent demonstrated experience
• Demonstrated ownership of thermal management for high-power semiconductor devices — GaN, GaAs, or comparable — including junction-temperature analysis, interface material selection, and validated correlation between thermal models and measured hardware
• Hands-on experience with microelectronic assembly processes: die attach, wirebond or flip-chip, hermetic sealing, and the inspection and screening methods that gate them
• Working fluency in RF behavior, not just mechanical implementation
• Experience designing to military or aerospace environmental standards with direct involvement in qualification campaigns
• Proficiency with mechanical CAD and thermal/structural simulation, and enough comfort with 3D EM tools to interrogate someone else's model
• Eligible to obtain and maintain a U.S. security clearance; U.S. Person status required for ITAR-controlled work