Substrate IC Package Layout Design Engineer
Etched · Taipei
Infrastructureonsitesenior
At a glance
Highlights
- Build hardware for frontier intelligence focused on inference workloads.
- Design complex IC substrate packages for high-power AI processors.
- Co-design chips, racks, software and manufacturing for best-in-class throughput.
What they offer
- Generous equity packages
- Comprehensive insurance coverage
- Top-of-market benefits
Ideal candidate
Veteran substrate layout engineer who loves pushing power delivery and high-speed signaling limits and thrives co-designing with silicon and systems teams in a fast-paced, in-person environment.
Requirements
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field
- 10+ years of experience in IC substrate layout design for high-performance processors or accelerators
- Extensive experience with large (>50mm) high-density substrate packages
- Proven experience with high-power 700W+ package designs and robust power delivery networks
- Expertise in high-speed signaling design beyond 50GHz and signal integrity mitigation
- Strong experience with CoWoS interposer design
- Advanced proficiency in Allegro Package Designer including constraint management and verification
- Deep understanding of SI/PI principles applied to package-level design
- remote policy
- Fully in-person
Lab profile
About Etched
Building specialized AI chips and systems for frontier inference with best-in-class throughput and latency.
What they build
- Sohu AI inference chip
- AI racks and hardware systems
- Inference software stack
Known for
- Full-stack co-design of chips, racks, software and manufacturing
- Best-in-class throughput and latency for prefill and decode
- Inference-optimized architecture
Key facts
- Backed by hundreds of millions from top-tier investors
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