Substrate IC Package Layout Design Engineer
Etched · San Jose
CHECKED 9H AGO
Infrastructureonsitesenior
At a glance
Highlights
- Design complex IC substrates for high-power AI processors and accelerators.
- Co-design chips, racks, and software for best-in-class AI inference.
- Optimize power delivery and high-speed signaling for frontier models.
What they offer
- Medical, dental, and vision packages with generous premium coverage
- Housing subsidy for those living within walking distance of office
- Relocation support for moves to San Jose
- Wellness benefits covering fitness and mental health
- Daily lunch and dinner in office
Ideal candidate
A seasoned hardware builder who thrives in fast-paced, in-person collaboration and cares about pushing limits for frontier AI inference.
Requirements
- Bachelor's or Master's in Electrical Engineering, Computer Engineering or related field
- 10+ years experience in IC substrate layout design for high-performance processors
- Experience with large >50mm high-density substrate packages
- Experience with 700W+ package designs and power delivery networks
- Expertise in >50GHz signaling and signal integrity mitigation
- Experience with CoWoS interposer design
- Proficiency in Allegro Package Designer
- Understanding of SI/PI principles at package level
Lab profile
About Etched
Building specialized AI chips and systems for frontier inference with best-in-class throughput and latency.
What they build
- Sohu AI inference chip
- AI racks and hardware systems
- Inference software stack
Known for
- Full-stack co-design of chips, racks, software and manufacturing
- Best-in-class throughput and latency for prefill and decode
- Inference-optimized architecture
Key facts
- Backed by hundreds of millions from top-tier investors