Thermal /Mechanical Hybrid Engineer
Etched · San Jose
CHECKED 7H AGO
Infrastructureonsitesenior
At a glance
Highlights
- Build thermal systems for inference-focused frontier AI hardware.
- Lead design of direct-to-chip cold plate modules in-house.
- Co-design chips, racks, software and manufacturing for throughput.
What they offer
- Medical, dental, and vision packages with generous premium coverage
- $500 per month credit for waiving medical benefits
- $2,500 per month housing subsidy for those living within walking distance
- Relocation support for those moving to San Jose
- Wellness benefits covering fitness, mental health, and more
- Daily lunch + dinner in office
- Unlimited compute budget subject to ROI justification
Ideal candidate
A hands-on thermal-mechanical engineer with deep cooling experience who loves owning hardware end-to-end and pushing performance for frontier AI systems in a collaborative in-person team.
Requirements
- Bachelor's degree in Mechanical Engineering or Thermal Engineering, or related field
- Minimum of 5 years of experience in thermal and mechanical engineering with focus on water cooling
- Proven expertise designing direct-to-chip / direct-to-processor cold plate modules
- Experience with water cooling systems including manifolds, quick disconnects, CDUs and heat exchangers
- Ability to run liquid thermal simulations to predict thermal performance
- Proficiency in mechanical CAD such as NX, Creo, CATIA or similar
- Proficiency in mechanical tolerances and GD&T drawings
- Knowledge of thermal interface materials (TIMs) and heat sink designs
- Experience with advanced cooling concepts including phase change and liquid cooling
- Apply DFM and DFA principles for manufacturing and assembly
- remote policy
- Fully in-person
Lab profile
About Etched
Building specialized AI chips and systems for frontier inference with best-in-class throughput and latency.
What they build
- Sohu AI inference chip
- AI racks and hardware systems
- Inference software stack
Known for
- Full-stack co-design of chips, racks, software and manufacturing
- Best-in-class throughput and latency for prefill and decode
- Inference-optimized architecture
Key facts
- Backed by hundreds of millions from top-tier investors