Hardware Systems Technical Lead
Lightmatter · Mountain View, CA
Infrastructureonsitelead$186k–$256k
At a glance
Highlights
- Lead board and system development for next-gen photonic AI accelerators.
- Deliver extreme-scale interconnect platforms using 3D-stacked photonics.
- Shape future computing with light for advanced AI and HPC workloads.
What they offer
- Comprehensive Health Care Plan (Medical, Dental & Vision)
- Retirement Savings Matching Program
- Life Insurance (Basic, Voluntary & AD&D)
- Generous Time Off (Vacation, Sick & Public Holidays)
- Paid Family Leave
- Short Term & Long Term Disability
- Training & Development
- Commuter Benefits
- Flexible, hybrid workplace model
- New hire equity grant and annual performance-based equity
Ideal candidate
Seasoned hardware leader with 12+ years taking complex systems from concept to production. You thrive in ambiguity, own outcomes end-to-end, and love mentoring engineers while pushing next-gen AI infrastructure forward.
Requirements
- Bachelor's degree in Electrical Engineering or related discipline with 12+ years relevant experience
- Track record taking multiple complex hardware systems from concept through production
- Deep knowledge of VRMs, high-speed SerDes, PCIe, Ethernet, SPI/QSPI, I3C, I2C, JTAG
- Experience leading multi-disciplinary development and troubleshooting across electrical, mechanical and firmware domains
- Strong ownership mindset with ability to work in ambiguous and dynamic environments
- Experience designing hardware for AI/HPC data center infrastructure, optical transceivers or silicon photonics
- Experience with Systems Engineering methodology, requirements traceability, FMEA and EVT/DVT/PVT planning
- Familiarity with advanced packaging technologies and high-density PCB design
- remote policy
- Flexible, hybrid workplace model
Lab profile
About Lightmatter
Building 3D-stacked photonics engines connecting AI processors at light speed for data centers.
What they build
- Passage™ 3D-stacked photonics engine
- Photonic interconnects for AI / HPC data centers
Known for
- Silicon photonics
- 3D-stacked packaging
- High-speed analog / mixed-signal design
- Electro-optic systems
Key facts
- Raised $400M Series D
- $4.4 billion valuation
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