Assembly and Packaging Process Engineer
Lyte · Remote (Taiwan) · Remote (Singapore)
Roboticsremoteentry-level to mid-level
At a glance
Highlights
- Support device packaging improvements for NPI and volume manufacturing.
- Support optical engine and subcomponent assembly with Asian CMs.
- Build perception systems for robotics, mobility, and automation.
What they offer
- Competitive salary and equity
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
Ideal candidate
Hands-on, fast-learning engineer with 1+ years experience who enjoys lab work, data analysis, and partnering with Asian manufacturers to improve cutting-edge optical products.
Requirements
- Bachelor's degree in Electrical Engineering, Photonics, Mechanical Engineering, or related field with 1+ years experience
- English communication capability
- Experience or knowledge of PCB assembly with SMT line
- Hands-on experience in laboratory experimentation and data analysis
- Familiar with Microsoft Office
- Fast learner with good work ethics and ability to maintain confidential information
Lab profile
About Lyte
Building perception infrastructure for robotics and Physical AI with custom silicon, sensors, and software.
What they build
- Perception systems for robotics, mobility and automation
- Electro-optical sensing modules
- Robotic hardware platforms
Known for
- Robot perception, state estimation and planning
- Learning-based behaviors and autonomy stacks
- Signal-processing algorithms for FPGA, GPU and silicon
- Mixed-signal ASICs, photonics and DSP hardware
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