Package, Assembly, Test (PAT) Team Lead
Lyte · Remote (Taiwan) · Remote (Singapore)
Roboticsremotelead
At a glance
Highlights
- Lead Asia operations supporting NPI and volume production with OSATs.
- Improve device packaging processes and drive Cp/Cpk gains with HQ teams.
- Build perception systems for robotics, mobility and next-gen automation.
What they offer
- Competitive salary and equity
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
Ideal candidate
Experienced packaging and test engineering leader who thrives in hands-on, fast-paced NPI environments and cares about building reliable hardware through close cross-functional collaboration.
Requirements
- Bachelor's degree with 12+ years of experience
- Device test knowledge across III-V CoC, wafer probe, packaged electro-optical devices, modules or PCBA
- Knowledge of III-V or CMOS wafer processes, bar-level, die attach, flip chip, wire bonding or module assembly
- Fast learner with strong work ethics and commitment to confidentiality
Lab profile
About Lyte
Building perception infrastructure for robotics and Physical AI with custom silicon, sensors, and software.
What they build
- Perception systems for robotics, mobility and automation
- Electro-optical sensing modules
- Robotic hardware platforms
Known for
- Robot perception, state estimation and planning
- Learning-based behaviors and autonomy stacks
- Signal-processing algorithms for FPGA, GPU and silicon
- Mixed-signal ASICs, photonics and DSP hardware
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