Senior Package Substrate Design Engineer
Lyte · Taiwan
Roboticsonsitesenior
At a glance
Highlights
- Own package and substrate design for chips in Lyte's 4D FMCW LiDAR platform.
- Drive multi-die modules from feasibility and planning to volume production.
- Co-package CMOS and silicon photonics with optical I/O and fiber attach.
What they offer
- Competitive salary and equity
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
Ideal candidate
Hands-on packaging veteran who owns designs end-to-end and thrives collaborating with US engineers and Taiwan suppliers to ship manufacturable, high-reliability packages for cutting-edge LiDAR hardware.
Requirements
- Bachelor's degree in Electrical, Electronic, Materials Science, Mechanical Engineering or related field
- 8+ years hands-on IC package and substrate design experience at OSAT, foundry, fabless/IDM or test interface supplier
- Expert proficiency in Cadence Allegro Package Designer (APD) and/or SiP Layout
- Working proficiency in Allegro PCB Editor/OrCAD, AutoCAD and CAM tools (e.g., CAM350)
Lab profile
About Lyte
Building perception infrastructure for robotics and Physical AI with custom silicon, sensors, and software.
What they build
- Perception systems for robotics, mobility and automation
- Electro-optical sensing modules
- Robotic hardware platforms
Known for
- Robot perception, state estimation and planning
- Learning-based behaviors and autonomy stacks
- Signal-processing algorithms for FPGA, GPU and silicon
- Mixed-signal ASICs, photonics and DSP hardware
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