Manufacturing Engineer Packaging & OSAT
Tenstorrent · 新北市, New Taipei City, Taiwan · Taiwan
CHECKED 23H AGO
Infrastructureonsite
At a glance
Highlights
- Own package manufacturing from design transfer to OSAT qualification and assembly.
- Lead factory commissioning, line bring-up, pilot builds and production ramp.
- Scale advanced AI silicon packaging across a global OSAT partner ecosystem.
Ideal candidate
Hands-on, data-driven manufacturing engineer who thrives on factory floors and with OSAT partners, bridging design and high-volume production through collaboration and curiosity.
Requirements
- 5+ years in semiconductor packaging, OSAT, assembly, PCBA, product or NPI engineering
- Experience taking packages or manufacturing lines from development to sustaining operations
- Comfortable working with OSATs, substrate, test houses and contract manufacturers
- Skilled interpreting package drawings, BGA maps, BOMs, PCB data and quality reports
- Expertise in SPC, DOE, PFMEA, 8D, CAPA, yield and process capability improvement
- remote policy
- Remote based in Taiwan with on-site partner factory work
Lab profile
About Tenstorrent
Builds high-performance RISC-V CPUs and AI accelerators with full-stack software for efficient AI computing.
What they build
- AI accelerators
- RISC-V CPUs
- AI software and compilers
Known for
- Custom RISC-V CPU development from scratch
- Full-stack AI hardware and software
- Performance, ease of use and cost efficiency
Key facts
- Founded in 2016
- Headquartered in Toronto, Canada
- Backed by Samsung and Hyundai Motor Group