Staff Engineer, Thermal Design

Highlights

• Lead thermal strategy for next-generation AI computing platforms.
• Architect advanced cooling for high-power PCIe cards and servers.
• Scale cooling solutions from chip level to rack-scale systems.

Ideal candidate

You are a collaborative thermal architect passionate about AI hardware who loves solving hard cooling challenges. You bring deep server experience and balance performance with manufacturability while mentoring others.

Requirements

• Bachelor's or master's degree in Thermal Engineering, Mechanical Engineering, or related technical field
• 10+ years of thermal design and architecture experience in enterprise servers, HPC, or specialized AI hardware
• Hands-on experience designing and deploying server-to-rack liquid-cooling systems including CDUs, manifolds, pumps, chillers, heat exchangers, cold plates, facility water loops and quick disconnects
• Highly proficient in Ansys IcePak, FloTHERM, or SOLIDWORKS Flow Simulation and 3D CAD, preferably SolidWorks
• Expertise in airflow management and hybrid cooling including vapor chambers, heat pipes, fans and advanced thermal interface materials
• Hands-on lab validation using environmental chambers, wind tunnels and liquid-cooling flow testers
• Familiar with Longwin thermal testing equipment, data loggers, pressure-decay analyzers, flow meters and airflow measurement systems
• Able to balance thermal performance with manufacturability, cost and reliability
• Able to travel internationally up to 10% of the time
• Eligible to access U.S. export-controlled technology